Does anyone have a English translation for 701.415.2 relating to Supplementary Equipotential Bonding in rooms containing a bath or shower?
Assuming that I have 30ma RCD protection for all circuits within the bathroom and that there is no metal waste pipe or accessible metallic structural parts of the building in the room does it mean:-
No Supplementary Equipotential Bonding is required for bathrooms that have copper piping
or
No Supplementary Equipotential Bonding is required for bathrooms that have push fit piping
or none of the above and something else entirely different
Assuming that I have 30ma RCD protection for all circuits within the bathroom and that there is no metal waste pipe or accessible metallic structural parts of the building in the room does it mean:-
No Supplementary Equipotential Bonding is required for bathrooms that have copper piping
or
No Supplementary Equipotential Bonding is required for bathrooms that have push fit piping
or none of the above and something else entirely different